Position Summary
Maintaining the FPYR, OEE and scrap performance in power circuit board assembly (PCBA) processes. Provides technical support to production and other related functions.
Key Responsibilities
- Sets up and programs SMT and DIP Machines for the new product up to mass production.
- Conducts process optimization, time study and defect analysis.
- Generates daily and weekly yield and OEE performance report.
- Presents daily and weekly reports (Yield, OEE, Scrap, Customer claim).
- Conducts process and product evaluation.
- Trains newly hired engineers and technicians to SMT and DIP Process.
- Provide process documentation and operating instructions in SMT and DIP Process.
- Collects data, writes reports, and presenting findings to management.
- Runs risk assessment and process being used.
- Conducts buy-ff qualification of newly acquired fixtures, material or product.
Qualifications
- Bachelor's degree in electrical engineering, mechanical engineering or related field
- Minimum 2 years of experience in other similar engineering job, including hands-on involvement in product and process design, testing, development and manufacturing processes.
- In-depth knowledge on PCBA process, equipment, customer requirements and other 3rd party requirements such as ISO 9001, AITF, IPC, regulatory standards, and manufacturing processes.
- Knowledge in statistical tools such as PowerBI, Minitab, Excel, CAM, Valor, CAD as well as SPC and DOE
- Problem-Solving Abilities: Demonstrated ability to identify process or equipment issues, analyze root causes, and develop effective solutions
- Proven experience in managing NPI projects from pilot to mass production, including defining project scope, creating project plans, allocating resources, and tracking progress.